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ASE Technology Holding Co., Ltd. Stock AnalysisComprehensive stock analysis for ASE Technology Holding Co., Ltd. (ASX) including live price, Snowflake performance metrics, financial statements, and investment research.Stock AnalysisASX

ASE Technology Holding Co., Ltd.

ASX
Sign In
  • Phase 1 · Company Overview
  • Phase 2 · FRC Research
  • Phase 3 · Financial Data
  • Phase 4 · Peer Comparison
  • Phase 5 · Ownership & News
ASX
Home🔹Stocks🔹ASE Technology Holding Co., Ltd.

ASE Technology Holding Co., Ltd.

ASX•NYSE

ASE Technology Holding Co., Ltd.

ASX•NYSE
Mkt Cap$30.69B
Sentiment

ASE Technology Holding Co., Ltd.

ASX
Sign In
  • Phase 1 · Company Overview
  • Phase 2 · FRC Research
  • Phase 3 · Financial Data
  • Phase 4 · Peer Comparison
  • Phase 5 · Ownership & News
ASX
Phase 1 · Company Overview
1

Step 1: Overview

What the company does, where it operates, and who runs it.

Overview for ASE Technology Holding Co., Ltd.

Industry:Semiconductors
Sector:Technology
CEO:Hung-Pen Chang
Description:ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.
Address:26, Chin 3rd Road, Kaohsiung, , TW
2

Step 2: Infographics

Visual summary of the business at a glance.

Phase 2 · FRC Research
3

Step 3: Media

Videos and interviews covering the company.

Phase 3 · Financial Data
4

Step 4: Stock Data

Price chart, volume, and trading data.

ASX Stock Price

5

Step 5: Fair Value

What FRC thinks the stock is worth vs. the current price.

6

Step 6: Financial Ratios

Profitability, returns, valuation, and leverage ratios.

7

Step 7: Dividend Analysis

Yield, payout ratio, and dividend coverage metrics.

8

Step 8: Earnings Analysis

EPS history, beat rate, and upcoming earnings reports.

9

Step 9: Financial Statements

Income statement, balance sheet, and cash flow statements.

Phase 4 · Peer Comparison
10

Step 10: Comparables

List of peer companies in the same industry.

Phase 5 · Ownership & News
12

Step 12: Institutional Ownership

Which funds and firms own the stock.

13

Step 13: Insider Trading

Recent buying and selling by company executives.

14

Step 14: Senate Trading

U.S. Senator disclosures filed under the STOCK Act.

15

Step 15: News

Latest headlines and market coverage.

News

Latest Market News

News

Latest Market News